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True, model free nanoscale IR absorption spectroscopy

• Expands nanoscale IR to a broad range of real world samples
• New resonance enhanced mode enables nanoscale IR on <20nm films
• Rich, interpretable IR spectra
• Designed and built for productivity and rapid time-to-results
• Multifunctional measurements including integrated
 thermal and mechanical property mapping
• Powerful, full featured AFM


AFM-IR applications

Wide range of AFM-IR applications with spatial resolution down to 10nm

Correlated Property mapping with nano-chemical nano-mechanics, nano-electrical and nano-thermal and topography

Versatile, full featured AFM
Every product in the Anasys Instruments family is built around our full featured AFM supporting many routinely used AFM imaging modes. These include tapping, phase, contact, force curves, lateral force, force modulation, EFM, MFM, CAFM and more.

Tapping image of block copolymer
Force modulation of polymer blend
Magnetic force microscopy of a magnetic tape
Tapping phase image of polymer nanocomposite

Mechanical spectroscopy and imaging
Broadband nanomechanical spectra utilizing Lorentz Contact Resonance (LCR) provides rich information about variations in material stiffness, viscosity and friction. LCR provides sensitive material contrast on materials ranging from soft polymers to hard inorganics and semiconductors.

Nanomechanical spectra (left) discriminate materials on the basis of stiffness and damping. Examples of LCR stiffness maps
on complex polymer blends (center) and high performance paper products (right).

Nanoscale thermal analysis (nanoTA)
Developed by Anasys Instruments, this award-winning technology uses Anasys ThermaLever™ probes to locally ramp the sample’s temperature to measure and map thermal transitions and other thermal properties.

Left: nanoTA uses a heated AFM tip to measure glass transition and melt temperatures with nanoscale spatial resolution. Middle: Thermal transition curves on a 21 layer laminated polymer film. Right: Scanning thermal microscopy visualizes variations in temperature and thermal conductivity on a sectioned circuit board.